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IC1000™ CMP Polishing Pads | DuPont
The IC1000™ series of pads for chemical mechanical planarization (CMP) is the industry standard. DuPont's IC1000™ pads are used in a wide variety of CMP applications today.
IC1000 CMP pad ENGLISH-US SDS 000001101537
Rohm and Haas Electronic Materials CMP, LLC Product name: IC1000TM Pad DN2 44.9" PSPS;XL63 AX Issue Date: 08/27/2018 Print Date: 03/22/2023 Rohm and Haas Electronic Materials CMP, LLC encourages and expects you to read and understand the entire (M)SDS, as there is important information throughout the document. We expect you to follow the …
NITTA HAAS ic1000
IC1000 is the de-facto standard as CMP pad. This product has an unique structure which has very small and uniform pores based on a special polyurethane material. It can achieve better slurry retention ability and high polishing removal rate with appropriate pad surface groove that helps slurry to spread quickly to under the wafer.
IC1000パッド｜アンカーテクノ
IC1000™パッドは、デバイスウェーハのCMPプロセスにおけるパッドとして、いと・をするのです。 なポリウレタン、なをもち、スラリーをにしながられたをします。 またGaN・SiCなどの・ダレにもがられます。 ※IC1000 …
Rodel® IC1000 CMP Pad
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.Rodel® IC1000 CMP Pad - N. Bucher AG
ed Polyurethane Pad IC1000
our customers. IC1000TM Series IC1000TM is th. de-facto standard as CMP pad. This product has an unique structure which has very small and uniform pores based on a. special polyurethane material. It can achieve better slurry retention ability and high polishing removal rate with appropriate pad surface groove that helps slurry to spr.
CMPパッド (CMP Pad)
CMP プロセスにおけるパッドのディファクトスタンダード、 それがIC1000TM です。 ポリウレタンをベースに、なをつそのユニークなはスラリーのをさせ、 さらにパッドをすことにより、スラリーをウェーハへにきらせ、 いをします。 パッドSUBATMシリーズとのみわせにより …
IC1000
IC1000TM IC1000TM pad is the industry-standard polishing pad for chemical mechanical polish. ng (CMP). The IC1000TM pad is made of a rigid, micro-porous polyurethane. material. These properties enable the IC1000TM pad to deliver localized planarization, excellent removal rates, low global non-uniformity, and low de.
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